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Trạm tháo, hàn BGA/SMT Manncorp RW1210

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Hãng sản xuất: Manncorp - Mỹ
Model: RW1210
Xuất xứ: Trung quốc

Kích thước PCB (Min): 50 mm x 10 mm (2" x 0.4")
Kích thước PCB Size (Max): 430 mm x 360 mm (17" x 14.25")
Độ dày PCB: 0.8 mm - 3 mm (0.032" to 0.12")
Kích thước linh kiện (Min): 2 mm x 2 mm (0.08" x 0.08")
Kích thước linh kiện (Maxm): 55 mm x 55 mm (2.16" x 2.16")
Min BGA Ball/QFP Lead Pitch: 0.3 mm (0.012")
Gia nhiệt linh kiện (lớp trên): không khí nóng (1200 W)
Gia nhiệt linh kiện (lớp dưới): không khí nóng(1200 W)
Gia nhiệt dưới: nhanh IR (2700 W)
Điều khiển nhiệt độ: kiểu K, PID
Nguồn:220 V ± 10%/ Single Phase, 50/60 Hz
Tổng công suất tiêu thụ: 5.3 KW Max.
Kích thước: 640 mm L x 630 mm W x 900 mm H
Trọng lượng: 68 Kg (150 lbs.)
Cung cấp bao gồm: 1 máy RW1210, 1 đầu típ thổi 35 mm x 35 mm, 01 đâu thổi, 55 mm x 55 mm, 01 bộ vòi  hút chân không (2 mm, 4 mm, 8 mm, 10 mm, 16 mm)
1 dây đo nhiệt độ kiểu K, 4 cái giữ chân PCB, 1 bộ tools kit

Chi tiết

Datasheet

Option:

NOZ7x7:    Topside nozzle 7 mm x 7mm for BR series          
NOZ8x8:    Topside nozzle 8 mm x 8 mm for BR series          
NOZ9x9:    Topside nozzle 9 mm x 9 mm for BR series          
NOZ12x12: Topside nozzle 12 mm x 12 mm for BR series  
NOZ15x15    :Topside nozzle 15 mm x 15 mm for BR series  
NOZ18x18    :Topside nozzle 18 mm x 18 mm for BR series  
NOZ20x20    :Topside nozzle 20 mm x 20 mm for BR series  
NOZ21x21    :Topside nozzle 21 mm x 21 mm for BR series  
NOZ24x24    :Topside nozzle 24 mm x 24 mm for BR series  

 

 

 

 

 

RW1210 Rework System Features

  • 1.3 Million Pixel, High-Definition, Split-Vision Optics with 230x Joystick-Controlled Zoom
  • High-Resolution 15" Full Color LCD Display for Simultaneous, Superimposed Viewing of Component Leads and PCB Pads
  • Independent Upper and Lower LED Lighting Adjustments for Component and PCB
  • Independent Top and Bottom Hot Air Heating with Eight-Zone Thermal Profiling
  • Programmable Heating Rate, Target Temperature, Dwell Time, and Cooling
  • Integrated Thermocouple Input for Real-Time Temperature Recording and Simplified Profiling
  • Adjustable Hot Air Flow Control Through Top Heater Nozzle Prevents Disturbance of Small SMDs During Reflow
  • Z-Axis Motion Control with Vertical Height Sensing for Automatic Removal and Placement of Delicate SMDs
  • High-Precision, Linear Z-Axis Slide and Optical Calibration Check for ±0.01mm Placement Accuracy
  • Ultra-Fine Micrometer Adjustments in X, Y, and Theta Axes for Fast, Easy, and Precise Alignment of Component Leads to PCB Pads
  • Large 350 mm x 250 mm (13.75" x 10"), Rapid-IR Underheater Prevents Board Warpage and Thermal Stress
  • Fully-Adjustable, Universal Board Holder for PCBs Up To 430 mm x 360 mm (17" x 14.25")
  • Convenient Laser Pointer Allows Quick and Easy Positioning of Component/PCB Inline Between Top and Bottom Heater Nozzles
  • Cross-Flow Fan for Rapid Solder Joint Cooling
  • Touch-screen User Interface with Password-Protected User Privileges
  • Screen Printing Functions via USB Port for Job/Lot Traceability
  • Full Range of Heater Nozzles Available to Solder/Desolder Components from 2 mm x 2 mm to 55 mm x 55 mm (0.08" x 0.08" to 2.16" x 2.16")
  • Internal Pump, Vacuum Generator, and Full Set of Vacuum Pick-Up Nozzles Included...No External Compressed Air or Vacuum NeededRW1210 - Specifications
     
    PCB Specifications
    PCB Size (Minimum) 50 mm x 10 mm (2" x 0.4") w/ standard edge rails
    No appreciable minimum with edge-pin holders included
    PCB Size (Maximum) 430 mm x 360 mm (17" x 14.25")
    PCB Thickness 0.8 mm - 3 mm (0.032" to 0.12")
    Component Specifications
    Component Size (Minimum) 2 mm x 2 mm (0.08" x 0.08")
    Component Size (Maximum) 55 mm x 55 mm (2.16" x 2.16")
    Minimum BGA Ball/QFP Lead Pitch 0.3 mm (0.012")
    Placement Accuracy ±0.01 mm (0.0004")
    Heating System
    Component Heater (Top Side) Hot Air (1200 W)
    Component Heater (Bott. Side) Hot Air (1200 W)
    Under-Heater Rapid IR (2700 W)
    Temperature Control K-Type Thermocouple; Closed Loop PID
    Utility Specifications / Facility Requirements
    Main Power Source 220 V ± 10%/ Single Phase, 50/60 Hz
    Total Power Consumption 5.3 KW Max. 
    Machine Dimensions 640 mm L x 630 mm W x 900 mm H
    (25.2" L x 24.8" W x 35.4" H) 
    Net Weight Approx. 68 Kg (150 lbs.)

Manncorp RW1210 SMT/BGA Rework System Includes:

  • 1 pc. RW1210 SMT/BGA Rework System with
    • Top and bottom hot air heating
    • Rapid IR underheater
    • Top heater hot air flow control
    • Automatic Z-axis motion with vertical height sensing
    • High-definition split-vision optics with 230x joystick-controlled zoom
    • Upper and lower LED lighting controls
    • Micrometer adjustment for X-, Y-, and theta alignment
    • Universal PCB holder for boards to 430 x 360 mm
    • Integrated thermocouple input
    • Laser pointer for bottom side heater/PCB setup positioning
    • Cross-flow cooling fan
    • LCD touch-screen controller and user interface
    • 15" high-resolution LCD display for alignment
  • 1 pc. 35 mm x 35 mm bottom heater nozzle
  • 1 pc 55 mm x 55 mm bottom heater nozzle
  • 1 set Vacuum pickup nozzles (2 mm, 4 mm, 8 mm, 10 mm, 16 mm)
  • 4 sets Heat-resistant suction tips for pickup nozzles (small, medium, large)
  • 1 pc. K-type thermocouple with connector
  • 4 pcs.Edge-pin PCB holders
  • 1 set Toolkit
  • 1-Year Parts Warranty

Gross Weight: 100 Kg (220 lbs)
Shipping Dimensions: 760 mm L x 760 mm W x 1050 mm H (30" L x 30" W x 41.3" H)
Net Weight: 68 Kg (150 lbs) 


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