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Universal Instrumnets Flexbond

  • 制造商: Universal Instruments
    Model: Flexbond
    保障: 12 month
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Manufacturer: Universal Instruments - USA

Model: Flexbond

Warranty: 12 months


The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

These configurable solutions have been shown to provide 6X to 12X the throughput of traditional semi-automated assembly stations and more than twice that of alternative automated hot bar solutions while reducing floor space requirements by 80%. They also require significantly fewer machines and offer the lowest OPEX and $/cph/m2.

  • The first high-throughput automated hot bar bonding platform

  • Industry-best performance and a maximum bonding rate of 1800 UPH

  • Dual-zone parallel processing with up to 6 heads per zone, 12 heads total (4X alternative solutions)

  • Programmable, closed-loop temperature control ensures alignment with solder profiles

  • Under-board constant heat balances thermal load for flex-to-flex applications

  • Programmable pressure settings and high-accuracy management provide superior bonding control

  • Conveyor-style architecture with adjustable width adapts to range of applications


FLEXBOND SPECIFICATIONS

Max Bonding Rate: 1800 UPH
Carrier Size: 100 x 100mm (Min) to 500 x 350mm (Max)
Bond Head Configuration: Dual-zone: 3 or 6 heads per zone
Hot Bar Head Heating: High-fidelity pulse heat up to 600°C or constant heat up to 200°C
Under-Board Heating: Constant heat up to 200°C
Temperature Control Accuracy: ±2°C, Cpk>1.33
Pressure Range: 0.5 to 12kg
Pressure Control Accuracy: ±70g per 1kg
Machine Dimensions (W x D x H): 1350 x 1500 x 2000mm

详细

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Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. With a lineage of more than 50 years, Universal is the longest-standing company in the electronics assembly space.

Universal provides complete solutions to meet specific requirements by leveraging its portfolio of flexible platforms for surface mount, through-hole, advanced semiconductor packaging, light mechanical, and final assembly processes. This best-in-class equipment set is complemented by state of the art software and operational services to help customers monitor and manage operational activities, improve efficiency and lower overall costs of manufacturing. Universal provides exclusive manufacturing process expertise through its world-renowned Advanced Process Lab, and delivers lasting value and support throughout all phases of the ownership experience through a global service infrastructure. Universal maintains offices in the Americas, Europe, and Asia, and is represented through a worldwide direct sales and distributor network.

For manufacturers who want to maximize return on investment for their electronics assembly solutions across the overall product life cycle, Universal Instruments delivers comprehensive, customer-focused solutions for all electronics production environments.

Leveraging innovative technologies and exclusive expertise, Universal solutions optimize time to market, overall efficiency for volume production, and investment protection for any product mix.

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